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Phase change materials have important application value in the fields of heat storage, cold storage, and thermal shock protection of electronic chips. In particular, in the field of chip thermal shock protection, phase change materials can use the solid-liquid phase change process to absorb a large amount of latent heat, thereby suppressing the temperature rise of the chip and preventing it from overheating. At present, there are mainly three types of common phase change materials: organic, inorganic and metallic phase change materials. There exists significant difference in the thermophysical properties of the three types of materials, and their thermal control performance also have their own characteristics. This paper sorts out the main thermophysical data of the three types of phase change materials. Through theoretical modeling and analysis, the thermal control performance of these materials is quantitatively evaluated and compared. For typical chip thermal shock conditions, the three types of phase change materials are compared, and their typical characteristics are intuitively displayed. The research results can serve as value reference for the development of phase change thermal control technology for chips.

Evaluation of thermal control performance of phase change materials for thermal shock protection of electronics