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The crack propagation was simulated by a generalized potential-based mixed-mode (PPR) cohesive interface model. Based on the principle of equivalence of thermal and mechanics, the effects of residual stress on interface crack propagation was researched by finite element model. The results demonstrate that residual compressive stress is more likely to cause material interface crack propagation. The material interface is more likely to fail when there is residual compressive stress in the material. The residual compressive stress is more likely to cause the interface crack propagation when the crack propagation length caused by certain residual compressive stress value is seen an important influence parameter.

Numerical research of influence of residual stress on interface crack propagation