Open AccessCrack- and Shrinkage-Free Ethylene-Bridged Polysilsesquioxane Film Prepared by a Hydrosilylation Reaction
Author(s) -
Takashi Hamada,
Yuki Nakanishi,
Kenta Okada,
Joji Ohshita
Publication year - 2021
Publication title -
acs omega
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.779
H-Index - 40
ISSN - 2470-1343
DOI - 10.1021/acsomega.1c00183
Subject(s) - hydrosilylation , ethylene , shrinkage , materials science , polymer chemistry , catalysis , thermal diffusivity , chemical engineering , composite material , chemistry , organic chemistry , physics , quantum mechanics , engineering
With the aim of developing an improved strategy for the preparation of ethylene-bridged polysilsesquioxanes as thermal insulator materials, this paper describes the synthesis of a crack- and shrinkage-free ethylene-bridged polysilsesquioxane film by the hydrosilylation reaction of hydrodimethyl-silylated oligomethylsilsesquioxane (MSQ-SiH) and dimethylvinyl-silylated oligomethylsilsesquioxane (MSQ-SiVi) in the presence of Karstedt's catalyst. Polysilsesquioxane precursors were prepared by the sol-gel reaction of triethoxymethylsilane and the successive capping reaction with chlorodimethylsilane and chlorodimethylvinylsilane. The obtained ethylene-bridged polysilsesquioxane film showed lower density and thermal diffusivity (1.13 g/cm 3 and 1.15 × 10 -7 m 2 /s, respectively) than a polymethylsilsesquioxane film (1.34 g/cm 3 and 1.36 × 10 -7 m 2 /s, respectively). As a result of the introduction of the SiCCSi ethylene bridge, the thermal insulation property of the polysilsesquioxane film was enhanced.