Open AccessA room temperature cured low dielectric hyperbranched epoxy adhesive with high mechanical strength
Author(s) -
Bibekananda De,
Niranjan Karak
Publication year - 2014
Publication title -
journal of chemical sciences
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.32
H-Index - 52
eISSN - 0973-7103
pISSN - 0253-4134
DOI - 10.1007/s12039-014-0595-y
Subject(s) - epoxy , thermosetting polymer , materials science , adhesive , composite material , dielectric , thermal stability , microelectronics , chemical engineering , nanotechnology , optoelectronics , layer (electronics) , engineering
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