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Dual beam organic depth profiling using large argon cluster ion beams
Author(s) -
Holzweber M.,
Shard A. G.,
Jungnickel H.,
Luch A.,
Unger W. E. S.
Publication year - 2014
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.5429
Subject(s) - sputtering , argon , analytical chemistry (journal) , chemistry , ion , cluster (spacecraft) , ion beam , oled , yield (engineering) , aluminium , materials science , atomic physics , thin film , nanotechnology , composite material , layer (electronics) , computer science , programming language , physics , organic chemistry , chromatography
Argon cluster sputtering of an organic multilayer reference material consisting of two organic components, 4,4′‐bis[N‐(1‐naphthyl‐1‐)‐N‐phenyl‐ amino]‐biphenyl (NPB) and aluminium tris‐(8‐hydroxyquinolate) (Alq 3 ), materials commonly used in organic light‐emitting diodes industry, was carried out using time‐of‐flight SIMS in dual beam mode. The sample used in this study consists of a ~400‐nm‐thick NPB matrix with 3‐nm marker layers of Alq 3 at depth of ~50, 100, 200 and 300 nm. Argon cluster sputtering provides a constant sputter yield throughout the depth profiles, and the sputter yield volumes and depth resolution are presented for Ar‐cluster sizes of 630, 820, 1000, 1250 and 1660 atoms at a kinetic energy of 2.5 keV. The effect of cluster size in this material and over this range is shown to be negligible. © 2014 The Authors. Surface and Interface Analysis published by John Wiley & Sons Ltd.