Broadband vertically interdigital‐capacitor with high frequency response improving

A broadband vertically interdigital‐capacitor (VIC) is proposed and fabricated in a 10‐layer low temperature co‐fired ceramic substrate. By interconnecting the open ends of interval fingers, the number of stop‐band structures is reduced and thus the spurs that limit the bandwidth are removed. With the orthogonally placed input/output ports, the amplitudes of transmission coefficient and reflection coefficient are also improved. Thus, the high frequency response of VIC is improved. The bandwidth and capacitance of the proposed VIC increased 225% and 28%, respectively. The proposed VIC is available to make compact microwave components in a wider frequency rage. Comparison and discussion are provided as well.