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Effect of Wavy Profile on the Fabrication and Mechanical Properties of Al/Ti/Al Composites Prepared by Rolling Bonding: Experiments and Finite Element Simulations
Author(s) -
Chen Wenhuan,
He Weijun,
Chen Zejun,
Zhou Zheng,
Liu Qing
Publication year - 2019
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201900637
Subject(s) - materials science , composite material , fabrication , scanning electron microscope , microstructure , annealing (glass) , ductility (earth science) , tension (geology) , strips , finite element method , ultimate tensile strength , structural engineering , medicine , creep , alternative medicine , pathology , engineering
The bonding interface plays an important role in the mechanical properties of laminated metal composites (LMCs). Compared with a straight interface, larger bonding area is achieved by a wavy interface, which provides higher debonding resistance for a given bonding strength. Herein, Al/Ti/Al LMCs with straight and wavy bonding interfaces are fabricated using Ti strips with initial straight and wavy profiles. The mechanical properties are investigated with in‐plane uniaxial tension tests. Microstructures in the region of the interface before and after tension are characterized by scanning electron microscopy and electron backscatter diffraction. Finite element simulations of the rolling‐bonding process and tension are conducted to investigate the effect of the wavy profile on the fabrication and mechanical properties of Al/Ti/Al LMCs. Compared with an initial straight profile, Al and wavy Ti strips are successfully bonded at a lower rolling reduction because of the larger local strain and higher local contact stress. Wavy interfaces between the Al and Ti layers are formed. Similar strength and ductility are obtained for Al/Ti/Al LMCs with straight and wavy interfaces when a proper rolling reduction and annealing are applied.