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Interconnect conductivity modeling is a critical aspect for modern chipdesign. Surface scattering -- an important scattering mechanism in scaledinterconnects is usually captured using Fuchs-Sondheimer (FS) model whichoffers the average behavior of the interconnect. However, to support the moderninterconnect structures (such as tapered geometries), modeling spatialdependency of conductivity becomes important. In Part I of this work, wepresented a spatially resolved FS (SRFS) model for rectangular interconnectsderived from the fundamental FS approach. While the proposed SRFS model offersboth spatial-dependency of conductivity and its direct relationship with thephysical parameters, its complex expression is not suitable for incorporationin circuit simulations. In this part, we build upon our SRFS model to propose acircuit-compatible conductivity model for rectangular interconnects accountingfor 2D surface scattering. The proposed circuit-compatible model offers spatialresolution of conductivity as well as explicit dependence on the physicalparameters such as electron mean free path (${\lambda}_0$), specularity ($p$)and interconnect geometry. We validate our circuit-compatible model over arange of interconnect width/height (and ${\lambda}_0$) and p values and show aclose match with the physical SRFS model proposed in Part I (with error <0.7%). We also compare our circuit-compatible model with a previous spatiallyresolved analytical model (appropriately modified for a fair comparison) andshow that our model captures the spatial resolution of conductivity and thedependence on physical parameters more accurately. Finally, we present asemi-analytical equation for the average conductivity based on ourcircuit-compatible model.

Spatially Resolved Conductivity of Rectangular Interconnects considering Surface Scattering -- Part II: Circuit-Compatible Modeling