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A new cryogenic packaging methodology that is widely applicable to packagingany integrated photonics circuit for operation at both room temperature andcryogenic temperature is reported. The method requires only equipment andtechniques available in any integrated optics lab and works on standardintegrated photonic chips. Our methodology is then used to enable themeasurement of a single photon pair sourced based on a silicon ring resonatorat cryogenic temperatures. When operating at 5.9 K, this source is measured tohave a peak pair generation rate 183 times greater then at room temperature inthe CL-band.

Packaged Cryogenic Photon Pair Source Using an Effective Packaging Methodology for Cryogenic Integrated Optics