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Understanding the nucleation and growth of polycrystalline thin films is along-standing goal. Polycrystalline films have many grains with differentorientations that affect thin-film properties. Numerous studies have been doneto determine these grain size and their preferred crystallographic orientationas well as stress in films. However most past studies have either employed anex-situ methodology or only monitor the development of macroscopic stress inreal-time. There has never been any research done on the simultaneousdetermination of crystallographic texture, grain size, and microscopic stressin polycrystalline thin films. In this study, we simultaneously monitored thegeneration and temporal evolution of texture, grain size, and internal stressin cathodic arc evaporated Al0.50Ti0.50N thin films using a bespoke depositionapparatus designed for use with 2-dimensional synchrotron x-ray diffractiontechnique. The influence of the substrate temperature is investigated in termsof the emergence and development of texture, grain size and stress evolution. Adynamic evolution of the crystallographic texture is observed as the overallfilm thickness varies. We clearly resolved two regime of films growth based onstress evolution. Beyond a threshold grain size (~ 14 nm), the stress scalesinversely to the average grain sizes, and as the film thickness increases,immediate compressive stress relaxation was seen. An extensive ex-situevaluation of thin films using electron microscopies and electron diffractionwas performed to support the in-situ x-ray diffraction results.

Dynamic evolution of internal stress, grain growth, and crystallographic  texture in arc-evaporated AlTiN thin films using in-situ synchrotron x-ray  diffraction