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A reliable and cost-effective interconnect technology is required for thedevelopment of hybrid pixel detectors. The interconnect technology needs to beadapted for the pitch and die sizes of the respective applications. Forsmall-scale applications and during the ASIC and sensor development phase,interconnect technologies must also be suitable for the assembly of single-diestypically available from Multi-Project-Wafer submissions. Within the CERN EPR&D program and the AIDAinnova collaboration, innovative and scalablehybridization concepts are under development for pixel-detector applications infuture colliders. This contribution presents recent results of a newlydeveloped in-house single-die interconnection process based on AnisotropicConductive Adhesives (ACA). The ACA interconnect technology replaces solderbumps with conductive micro-particles embedded in an epoxy layer applied aseither film or paste. The electro-mechanical connection between the sensor andASIC is achieved via thermocompression of the ACA using a flip-chip devicebonder. A specific pixel-pad topology is required to enable the connection viamicro-particles and create cavities into which excess epoxy can flow. Thispixel-pad topology is achieved with an in-house Electroless Nickel ImmersionGold process that is also under development within the project. The ENIG andACA processes are qualified with a variety of different ASICs, sensors, anddedicated test structures, with pad diameters ranging from 12 {\mu}m to 140{\mu}m and pitches between 20 {\mu}m and 1.3 mm. The produced assemblies arecharacterized electrically, with radioactive-source exposures, and in testswith high-momentum particle beams. A focus is placed on recent optimization ofthe plating and interconnect processes, resulting in an improved platinguniformity and interconnect yield.

Pixel detector hybridization and integration with anisotropic conductive adhesives