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The proposed Circular Electron Positron Collider (CEPC) imposes newchallenges for the vertex detector in terms of pixel size and material budget.A Monolithic Active Pixel Sensor (MAPS) prototype called TaichuPix, based on acolumn drain readout architecture, has been developed to address the need forhigh spatial resolution. In order to evaluate the performance of theTaichuPix-3 chips, a beam test was carried out at DESY II TB21 in December2022. Meanwhile, the Data Acquisition (DAQ) for a muti-plane configuration wastested during the beam test. This work presents the characterization of theTaichuPix-3 chips with two different processes, including cluster size, spatialresolution, and detection efficiency. The analysis results indicate the spatialresolution better than 5 $\mu m$ and the detection efficiency exceeds 99.5 %for both TaichuPix-3 chips with the two different processes.

Beam test of a 180 nm CMOS Pixel Sensor for the CEPC vertex detector