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In this paper, we present a new analytical 3D placement framework with abistratal wirelength model for F2F-bonded 3D ICs with heterogeneous technologynodes based on the electrostatic-based density model. The proposed framework,enabled GPU-acceleration, is capable of efficiently determining nodepartitioning and locations simultaneously, leveraging the dedicated 3Dwirelength model and density model. The experimental results on ICCAD 2022contest benchmarks demonstrate that our proposed 3D placement framework canachieve up to 6.1% wirelength improvement and 4.1% on average compared to thefirst-place winner with much fewer vertical interconnections and up to 9.8xruntime speedup. Notably, the proposed framework also outperforms thestate-of-the-art 3D analytical placer by up to 3.3% wirelength improvement and2.1% on average with up to 8.8x acceleration on large cases using GPUs.

Analytical Die-to-Die 3D Placement with Bistratal Wirelength Model and GPU Acceleration