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Despite several decades of development, microfluidics lacks a sealingmaterial that can be readily fabricated, leak-tight under high liquid waterpressure, stable over a long time, and vacuum compatible. In this paper, wereport the performances of a micro-scale processable sealing material fornanofluidic/microfluidics chip fabrication, which enables us to achieve allthese requirements. We observed that micrometric walls made of SU-8photoresist, whose thickness can be as low as 35 $\mu$m, exhibit water pressureleak-tightness from 1.5 bar up to 5.5 bar, no water porosity even after 2months of aging, and are able to sustain under $10^{-5}$ mbar vacuum. Thissealing material is therefore reliable and versatile for building microchips,part of which must be isolated from liquid water under pressure or vacuum.Moreover, the fabrication process we propose does not require the use ofaggressive chemicals or high-temperature or high-energy plasma treatment. Itthus opens a new perspective to seal microchips where delicate surfaces such asnanomaterials are present.

Quantifying the performances of SU-8 microfluidic devices: high liquid water tightness, long-term stability, and vacuum compatibility