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Power electronics systems, widely used in various applications such asindustrial automation, electric cars, and renewable energy, have the primaryfunction of converting and controlling electrical power to the desired type ofload. Despite their reliability and efficiency, power losses in these systemsgenerate significant heat that must be dissipated to maintain performance andprevent damage. Cooling systems play a crucial role in ensuring safe operatingtemperatures for system components. Air and liquid cooling are the leadingtechnologies used in the power electronics world. Air cooling is simple andcost-effective but is limited by ambient temperature and component thermalresistance. While more efficient, liquid cooling requires more maintenance andhas higher upfront costs. Water-cooling systems have become famous forregulating thermal loads as they can effectively remove heat from localizedhigh-temperature areas, such as the challenging hotspots in power electronicssystems. In addition to designing a cooling system for a power electronicsystem, this study investigated the impact of three major parameters; coldplate material, channel shape/size, and coolant inlet velocity. The researchexamined and analyzed these factors and their trade-off analysis to obtaincooling system design and optimization insights. This study might improve powerelectronics system performance, reliability, and durability by improving heatdissipation and thermal management.

Liquid Cooling System for a High Power, Medium Frequency, and Medium Voltage Isolated Power Converter