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Ad-hoc interface PCBs are today the standard connection between cryogeniccabling and quantum chips. Besides low-loss andlow-temperature-dependent-dielectric-permittivity materials, FR4 provides alow-cost solution for fabrication of cryogenic PCBs. Here, we report on aneffective way to evaluate the dielectric performance of a FR4 laminate used assubstrate for cryogenic microwave PCBs. We designed a coplanar waveguide{\lambda}/2 open-circuit series resonator and we fabricated the PCB using alow-cost manufacturing process. Such a geometry allows to exploit the resonancepeak of the resonator to measure the variation of the complex dielectricpermittivity as a function of the temperature. Resonance peak frequency andmagnitude were used as sensing parameters for the real part of dielectricpermittivity and dielectric loss tangent, respectively. We estimated a 9 %reduction of the real part of the dielectric permittivity and a 70 % reductionof the dielectric loss tangent in the temperature range from 300 to 4 K. Theproposed approach can be immediately extended to the detection of cryogenictemperature-dependent dielectric performance of any kind on substrate.

Estimation of the FR4 Microwave Dielectric Properties at Cryogenic Temperature for Quantum-Chip-Interface PCBs Design