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The Inner Tracking System (ITS) of the ALICE experiment at CERN will undergoan upgrade during the LHC long shutdown 3, in which the three innermosttracking layers will be replaced. This upgrade, named the Inner Tracking System3 (ITS3), employs stitched wafer-scale Monolithic Active Pixel Sensorsfabricated in a 65 nm CMOS process. The sensors are 260 mm in length andthinned to less than 50 um then bent to form truly half-cylindricalhalf-barrels. The feasibility of this process for the ITS3 was explored withthe first test production run (MLR1) in 2021, whose goal was to evaluate thecharged particle detection efficiency and the sensor performance undernon-ionising and ionising radiation up to the expected levels for ALICE ITS3 of$10^{13}$ $1$ MeV n$_{\mathrm{eq}}$ cm$^{-2}$ (NIEL) and 10 kGy (TID). Threesensor flavours were produced to investigate this process: Analog Pixel TestStructure (APTS), Circuit Exploratoire 65 (CE65) and Digital Pixel TestStructure (DPTS).  This contribution gives an overview of the MLR1 submission and test results,describing the different sensor flavours and presenting the results of theperformance measurements done with particle beams for various chip variants andirradiation levels.

First measurements with monolithic active pixel test structures produced in a 65 nm CMOS process