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Additive microfabrication processes based on localized electroplating enablethe one-step deposition of micro-scale metal structures with outstandingperformance, e.g. high electrical conductivity and mechanical strength. Theyare therefore evaluated as an exciting and enabling addition to the existingrepertoire of microfabrication technologies. Yet, electrochemical processes aregenerally restricted to conductive or semiconductive substrates, precludingtheir application in the manufacturing of functional electric devices wheredirect deposition onto insulators is often required. Here, we demonstrate thedirect, localized electrodeposition of copper on a variety of insulatingsubstrates, namely Al2O3, glass and flexible polyethylene, enabled byelectron-beam-induced reduction in a highly confined liquid electrolytereservoir. The nanometer-size of the electrolyte reservoir, fed byelectrohydrodynamic ejection, enables a minimal feature size on the order of200 nm. The fact that the transient reservoir is established and stabilized byelectrohydrodynamic ejection rather than specialized liquid cells could offergreater flexibility towards deposition on arbitrary substrate geometries andmaterials. Installed in a low-vacuum scanning electron microscope, the setupfurther allows for operando, nanoscale observation and analysis of themanufacturing process.

Direct in- and out-of-plane writing of metals on insulators by electron-beam-enabled, confined electrodeposition with submicrometer feature size