English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Plus monthly

Global: Zendy Tools annual

Global: Zendy Tools monthly

Global: Zendy Free Plan

Efficient delivery of current from PCB to point-of-load (POL) is a primaryconcern in modern high-power high-density integrated systems. Traditionally, a48 V power signal is converted to the low, POL voltage at the board and/orpackage level. As interconnect has become the dominant power loss component,minimizing voltage drop across the laterally routed portions of theboard-to-die interconnect (referred to as horizontal interconnect) is apromising approach to enhance the efficiency of the power delivery system.Delivering lower current vertically, at a higher voltage should therefore beconsidered. High-power conversion near POL, however, results in higherswitching and inductor losses, exhibiting an undesired power efficiencytradeoff. To address this problem, four vertical power delivery architecturesare proposed in this paper, considering state-of-the-art power convertertopologies, integration levels, and voltage conversion schemes. EmbeddingSilicon (Si) and Gallium Nitride (GaN) power devices and inductors on top ofand/or within the interposer is investigated. Integrating GaN power devices ona dedicated power die is also discussed. Various multi-stage 48V-to-1V powerconversion schemes are examined and state-of-the-art power conversion circuitsare reviewed. Power delivery characteristics with these architectures aredetermined for a high power (1 kW) high-current density (2 A/mm$^2$) system.

Vertical Power Delivery for Emerging Packaging and Integration Platforms -- Power Conversion and Distribution