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An earlier study of a high layer-count test board using plated-through-hole(PTH) vias and a limited quantity of laser vias was shown to be capable ofsupporting 112 Gb/s PAM-4 links (or equivalent signaling having 28 GHz(Nyquist) bandwidth). This original board design was then rebuilt using adifferent fabricator, and the test results revealed a significant decrease inthe bandwidth of the vias. These results led to the development of a set ofdesign specifications that PCB vendors can easily validate, which will ensurethat the use of high layer-count boards with PTH technology are viable foremerging 112 Gb/s PAM-4 links.

Plated-Through-Hole Via Design Specifications for 112G Serial Links