English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Plus monthly

Global: Zendy Tools annual

Global: Zendy Tools monthly

Global: Zendy Free Plan

The increase in the number of counterfeit and recycled microelectronic chipsin recent years has created significant security and safety concerns in variousapplications. Hence, detecting such counterfeit chips in electronic systems iscritical before deployment in the field. Unfortunately, the conventionalverification tools using physical inspection and side-channel methods arecostly, unscalable, error-prone, and often incompatible with legacy systems.This paper introduces a generic non-invasive and low-cost counterfeit chipdetection based on characterizing the impedance of the system's power deliverynetwork (PDN). Our method relies on the fact that the impedance of thecounterfeit and recycled chips differs from the genuine ones. To sense suchimpedance variations confidently, we deploy scattering parameters, frequentlyused for impedance characterization of RF/microwave circuits. Our proposedapproach can directly be applied to soldered chips on the system's PCB and doesnot require any modifications on the legacy systems. To validate our claims, weperform extensive measurements on genuine and aged samples from two families ofSTMicroelectronics chips to assess the effectiveness of the proposed approach.

Counterfeit Chip Detection using Scattering Parameter Analysis