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Detectors based on pixels with timing capabilities are gaining increasingimportance in the last years. Next-to-come high-energy physics experiments atcolliders require the use of time information in tracking, due to the expectedlevels of track densities in the foreseen experimental conditions. A promisingsolution to gain high-resolution performance at the sensor level is given byso-called 3D silicon sensors. The excellent intrinsic time resolution of aspecial case of 3D sensors, the trench type, is limited by residualnon-uniformities in the duration of the induced currents. The intrinsiccontribution of the sensor to the total time resolution of the system, when thedetector is coupled to a front-end electronics, depends on the characteristicsof the electronics itself and can be minimized with a proper design. This paperaims to analyze the possible performance in the timing of a typically-usedfront-end circuit, the Trans-Impedance Amplifier, considering differentpossible configurations. Evidence of the preferred modes of operation in sensorread-out for timing measurement will be given.

Timing performances of front-end electronics with 3D-trench silicon sensors