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The residual stress plays a vital role in determination of the deviceperformance that uses thin films coating and thus the accurate determination ofstress and its optimization with process parameters is an ongoing research workfor many decades. In line with this, the microscopic origin of the stress atthe atomic scale and its development during the thin film deposition is amatter of major scientific interests. The development of stress is a complexphenomenon and has a complex dependence to process parameters, filmmicrostructure and its morphology. In this work, by utilizing a custom-designedcathodic arc deposition system and synchrotron radiation based 2D x-raydiffraction (XRD) technique, we determine the real-time evolution of stress,crystallite sizes and their preferential orientations ofAluminum-Titanium-Nitride (AlxTi1-xN) films with varied Al-content (x=0.0,0.25, 0.50, and 0.67) on Si-100 substrate. The energies of incoming ions andhence stress in the films is tuned by applying different direct currentsubstrate bias (Vs = floating potential, -20, -40, -60, -80, and -100 V). Theinstantaneous stress is evaluated by the well-known d vs. sin2{\psi} technique,while crystallite sizes are determined by analyzing line profiles of x-raydiffractograms. The evolution of stress and crystallite sizes are modelled withmultiple numerical models from which kinetic parameters associated with thethin film depositions are extracted. The ex-situ microstructurecharacterizations of AlxTi1-xN coatings are carried out by scanning electronmicroscopy (SEM) and transmission electron microscopy (TEM). The formation ofex-situ microstructure of the films is discussed considering the resultsobtained from in-situ XRD data. Finally, we demonstrate that the methodutilized here is a powerful approach towards estimation of the fracturetoughness of thin film coatings.

In-situ real-time evolution of intrinsic stresses and microstructure during growth of cathodic arc deposited (Al,Ti)N coatings