English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Plus monthly

Global: Zendy Tools annual

Global: Zendy Tools monthly

Global: Zendy Free Plan

Focused ion beam (FIB) has been used as an effective tool for precisenanoscale fabrication. It has recently been employed to tailor defectengineering in functional nanomaterials such as two-dimensional transitionmetal dichalcogenides (TMDCs), providing desirable properties in TMDC-basedoptoelectronic devices. However, the damage caused by the FIB irradiation andmilling process to these delicate atomically thin materials, especially in theextended area, has not yet been elaboratively characterised. Understanding thecorrelation between lateral ion beam effects and optical properties of 2D TMDCsis crucial in designing and fabricating high-performance optoelectronicdevices. In this work, we investigate lateral damage in large-area monolayerWS2 caused by the gallium focused ion beam milling process. Three distinctzones away from the milling location are identified and characterised viasteady-state photoluminescence (PL) and Raman spectroscopy. An unexpectedbright ring-shaped emission around the milled location has been revealed bytime-resolved PL spectroscopy with high spatial resolution. Our finding opensnew avenues for tailoring the optical properties of TMDCs by charge and defectengineering via focused ion beam lithography. Furthermore, our study providesevidence that while some localised damage is inevitable, distant destructioncan be eliminated by reducing the ion beam current. It paves the way for theuse of FIB to create nanostructures in 2D TMDCs, as well as the design andrealisation of optoelectrical devices on a wafer scale.

Understanding the impact of heavy ions and tailoring the optical properties of large-area Monolayer WS2 using Focused Ion Beam