English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Zendy Plus

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Zendy Tools

Zendy Open

The challenging demands of the ATLAS High Luminosity (HL-LHC) Upgrade aim fora complete swap of new generation sensors that should cope with the ultimateradiation hardness. FBK has been one of the prime foundries to develop andfabricate such radiation-hard 3D silicon (Si) sensors. These sensors are chosento be deployed into the innermost layer of the ATLAS Inner Tracker (ITk).Recently, a pre-production batch of 3D Si sensors of 50x50 um2 pixel geometry,compatible with the full-size ITKPix (RD53B) readout chip, was fabricated. Twowafers holding temporary metal were diced at IZM, Germany, and a systematic QCtest campaign was carried out at the University of Trento electronicslaboratory. The paper briefly describes the 3D Si sensor design for ATLAS ITkand the required QC characterization setups. It comprises electrical tests(i.e., I-V, C-V, and I-T) of non-irradiated RD53B sensors. In addition, thestudy of several parametric analyses, i.e., oxide charge density, oxidethickness, inter-pixel resistance, inter-pixel capacitance, etc., are reportedwith the aid of Process Control Monitor (PCM) structures.

Quality Control (QC) of FBK Preproduction 3D Si Sensors for ATLAS HL-LHC Upgrades