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This paper describes a temperature sensitivity or thermal sag measurement ofa geometric anti-spring based micro-electromechanical system (MEMS) gravimeter(Wee-g). The Wee-g MEMS gravimeter is currently fabricated on a (100) siliconwafer using standard micro-nano fabrication techniques. The thermal behavior ofsilicon indicates that the Young's modulus of silicon decreases with anincrease in temperature (around 63 ppm/K). This leads to a softening of thesilicon material resulting in the proof mass (PM) displacing (or sagging) underthe influence of an increasing temperature. It results in the change on themeasured gravity and it is expressed as a temperature sensitivity in terms ofchange in gravity per degree temperature. The temperature sensitivity for thesilicon based MEMS gravimeter is found to be 60.14-64.87 muGal/mK, 61.76muGal/mK and 62.76 muGal/mK for experimental, finite element analysis (FEA)simulation and analytical calculations respectively. It suggests thattemperature sensitivity is depended on material properties used to fabricatethe MEMS devices. In this paper the experimental measurements of thermal sagare presented, along with analytical calculations and simulations of the effectusing FEA (finite element analysis). The bespoke optical measurement system toquantify the thermal sag is also described. The results presented are anessential step towards the development of temperature insensitive MEMSgravimeters.

Invetigation of Temperature Sensitivity of a Geomteric Anti-Spring based MEMS Gravimeter