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Defect detection plays a vital role in the manufacturing process ofintegrated circuits (ICs). Die attachment and wire bonding are two steps of themanufacturing process that determine the power and signal transmission qualityand dependability in an IC. This paper presents a survey or literature reviewof the methods used for detecting these defects based on different sensingmodalities used including optical, radiological, acoustical, and infraredthermography. A discussion of the detection methods used is provided in thissurvey. Both conventional and deep learning approaches for detecting dieattachment and wire bonding defects are considered along with challenges andfuture research directions.

A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing