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The chiplet-based System-in-Package~(SiP) technology enables more designflexibility via various inter-chiplet connection and heterogeneous integration.However, it is not known how to convert such flexibility into cost efficiency,which is critical when making a design decision. In this paper, we develop ananalytical cost model that can estimate the cost of the 2.5D chiplet-based SiPsystems under various interconnection options and technology nodes. Weconducted two case studies using our cost model to explore the costcharacteristics of the 2.5D chiplet-based SiP system. Based on the casestudies, we made several observations on the interposer selection, designpartition granularity, and technology node adoption for cost-efficientchiplet-based SiP design.

Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies