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Application Specific Integrated Circuits (ASICs) are used in space-borneinstruments for signal processing and detector readout. The electricalinterface of these ASICs to frontend printed circuit boards (PCBs) is commonlyaccomplished with wire bonds. Through Silicon Via (TSV) technology has beenproposed as an alternative interconnect technique that will reduce assemblycomplexity of ASIC packaging by replacing wire bonding with flip-chip bonding.TSV technology is advantageous in large detector arrays where TSVs enable closedetector tiling on all sides. Wafer-level probe card testing of TSV ASICs isfrustrated by solder balls introduced onto the ASIC surface for flip-chipbonding that hamper alignment. Therefore, we developed the ASIC Test Stand(ATS) to enable rapid screening and characterization of individual ASIC die. Wesuccessfully demonstrated ATS operation on ASICs originally developed forCdZnTe detectors on the Nuclear Spectroscopic and Telescope Array (NuSTAR)mission that were later modified with TSVs in a via-last process. We testedboth back-side blind-TSVs and front-side through-TSVs, with results frominternal test pulser measurements that demonstrate performance equal to orexceeding the probe card wafer-level testing data. The ATS can easily beexpanded or duplicated in order to parallelize ASIC screening for large areaimaging detectors of future space programs.

Testing Station for Fast Screening of Through Silicon Via (TSV)-enabled  Application Specific Integrated Circuits (ASICs) for Hard X-ray Imaging  Detectors