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Optical I/O plays a crucial role in the lifespan of lab-on-a-chip systems,from preliminary testing to operation in the target environment. However, dueto the precise alignments required, efficient and reliable fiber-to-chipconnections remain challenging, yielding inconsistent test results and unstablepackaged performance. To overcome this issue, for use in single mode on-chipsystems, we propose the incorporation of area-enlarged grating couplers workingin conjunction with multimode fibers. This combination enables simpler, faster,and more reliable connections than the traditional small area grating couplerwith single-mode fiber. In this work, we experimentally demonstrate a 3dBin-plane (X, Y) spatial tolerance of (10.2 {\mu}m, 17.3 {\mu}m) for the largearea configuration, being at least (2.49, 3.33) times that of the small areaone, and agreeing well with theoretical calculations. The simple concept isreadily applicable to a range of photonic systems where cheaper more robustoptical I/O is desired.

Packaging-enhanced optical fiber-chip interconnect with enlarged grating coupler and multimode fiber