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Dense and efficient circuits with component sizes approaching the physicallimit is the hallmark of high performance integration. However, currentfabrication technology is mostly constraint to 2D lithography, and thermalenergy dissipation induced by switching electronic signal lines presents afundamental challenge for truly 3D electronic integration. Photonics reducesthis problem, and direct laser writing of a photoresin is a promisinghigh-resolution tool for 3D photonic integration. Here, we combine one andtwo-photon polymerization (TPP) for waveguide integration for the first time,dramatically accelerating the fabrication process and increasing opticalconfinement. 3D additive printing is based on femtosecond TPP, while blanketirradiation with a UV lamp induces one-photon polymerization (OPP) throughoutthe entire 3D chip. We locally and dynamically adjust writing conditions toimplement (3+1)D \emph{flash}-TPP: waveguide cores are printed with a smalldistance between neighboring writing voxels to ensure smooth interfaces,mechanical support structures are printed at maximal distance between thevoxels to speed up the process. Finally, the entire chip's \emph{passive}volume not part of waveguide cores or mechanical support is polymerized in asingle instance by UV blanket irradiation. This decouples fabrication time fromthe passive volume's size. We succeed in printing vertical single-modewaveguides of 6~mm length that reach up to NA = 0.16. Noteworthy, we achieveexceptionally low -0.26 dB injection and very low propagation losses of -1.36dB/mm, which is within one order of magnitude of standard integrated siliconphotonics. Finally, the optical performance of our waveguides does notdeteriorate during 120 days within our measurement uncertainty.

Combining one and two photon polymerization for accelerated high performance (3+1)D photonic integration