English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Plus monthly

Global: Zendy Tools annual

Global: Zendy Tools monthly

Global: Zendy Free Plan

High-dimensional encoding and hyper-entanglement are unique features thatdistinguish optical photons from other quantum information carriers, leading toimproved system efficiency and novel quantum functions. However, the disparaterequirements to control different optical degrees of freedom have prevent thedevelopment of complete integrated platforms that is capable of leveraging thecomplementary benefits of high-dimensional encoding and hyper-entanglement atthe same time. Here we demonstrate the chip-scale solution to the generationand manipulation of high-dimensional hyper-entanglement. This is achieved bythe parallel processing of multiple quantum frequency combs in the path domain.Cavity-enhanced parametric down-conversion with Sagnac configuration isimplemented to ensure the spectral indistinguishability. Simultaneousentanglement in path and frequency is realized with high dimensions. On-chipreconfiguration of the entanglement structure is also demonstrated. We furtherpresent quantum interference in both entanglement degrees of freedom with highvisibility. Our work provides the critical step for the efficient and parallelprocessing of quantum information with integrated photonics.

On-chip parallel processing of quantum frequency combs for high-dimensional hyper-entanglement generation