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Next generation communication and sensing require enabling technologies forminiaturized and efficient heterogeneous systems while integrating technologiesranging from silicon to compound semiconductors and from photonic chips tomicro-sensors. To this end, high frequency and mm-wave (MMW) lossy parasiticsand delay between modules need to be significantly reduced to minimize area,loss and thermal heating of inter-chip wiring and power delivery networks. Inthis work, we propose novel approaches to achieve an efficient wideband MMWarray integrations. The proposed techniques are built upon the following: 1)fixed antenna package buildup for every element with differential excitation ontwo half sides of array to reduce the fabrication cost and the IC-to-antennarouting loss; 2) miniaturized aperture coupled local oscillator (LO) andintermediate frequency (IF) power delivery feed distribution to minimize thepackaging stacked layers and their loss. The proposed 16-element antenna arrayis integrated which 4 dies in 2x2 configurations implemented in a 90-nm SiGeBiCMOS process using compact Weaver image-selection architecture (WISA). Theproposed miniaturized and efficient architecture from circuit and chip level topackage level results in 1.5 GHz modulation bandwidth for 64 QAM (9 Gb/s) and 2GHz for 16 QAM with only +-2 dB EVM variation over the 20% FBW (71-86 GHz). Thesystem produces 30-dBm EIRP with enhanced efficiency of 25% EIRP/PDC over thebandwidth

Compact Heterogeneous Integration for Next Generation High Frequency Scalable Array with Miniaturized and Efficient Power Delivery Network