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Wafer-level performance prediction has been attracting attention to reducemeasurement costs without compromising test quality in production tests.Although several efficient methods have been proposed, the site-to-sitevariation, which is often observed in multi-site testing for radio frequencycircuits, has not yet been sufficiently addressed. In this paper, we propose awafer-level performance prediction method for multi-site testing that canconsider the site-to-site variation. The proposed method is based on theGaussian process, which is widely used for wafer-level spatial correlationmodeling, improving the prediction accuracy by extending hierarchical modelingto exploit the test site information provided by test engineers. In addition,we propose an active test-site sampling method to maximize measurement costreduction. Through experiments using industrial production test data, wedemonstrate that the proposed method can reduce the estimation error to 1/19 ofthat obtained using a conventional method. Moreover, we demonstrate that theproposed sampling method can reduce the number of the measurements by 97% whileachieving sufficient estimation accuracy.

Wafer-level Variation Modeling for Multi-site RF IC Testing via Hierarchical Gaussian Process