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Digital image correlation (DIC) and crystal plasticity simulation wereutilised to study cold dwell behaviour in a coarse grain Ti-6Al alloy at 3different temperatures up to 230 C. Strains extracted from large volume grainswere measured during creep by DIC and were used to calibrate the crystalplasticity model. The values of critical resolved shear stresses (CRSS) of thetwo main slip systems (basal and prismatic) were determined as a function oftemperature. Stress along paths across the boundaries of two grain pairs, (1) a`rogue' grain pair and (2) a `non-rogue' grain pair, were determined atdifferent temperatures. Load shedding was observed in the `rogue' grain pair,where a stress increment during the creep period was found in the `hard' grain.At elevated temperatures, 120 C was found to be the worst-case scenario as thestress difference at the grain boundaries of these two grain pairs were foundto be the largest among the three temperatures. This can be attributed to thefact that the strain rate sensitivity of both prismatic and basal slip systemsis at its greatest in this worst-case scenario temperature.

Cold dwell behaviour of Ti$_6$Al alloy: Understanding load shedding using digital image correlation and crystal plasticity simulations