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Aluminum scandium nitride alloy (Al1-xScxN) is regarded as a promisingmaterial for high-performance acoustic devices used in wireless communicationsystems. Phonon scattering and heat conduction processes govern the energydissipation in acoustic resonators, ultimately determining their performancequality. This work reports, for the first time, on phonon scattering processesand thermal conductivity in Al1-xScxN alloys with the Sc content (x) up to0.26. The thermal conductivity measured presents a descending trend withincreasing x. Temperature-dependent measurements show an increase in thermalconductivity as the temperature increases at temperatures below 200K, followedby a plateau at higher temperatures (T> 200K). Application of a virtual crystalphonon conduction model allows us to elucidate the effects of boundary andalloy scattering on the observed thermal conductivity behaviors. We furtherdemonstrate that the alloy scattering is caused mainly by strain-fielddifference, and less by the atomic mass difference between ScN and AlN, whichis in contrast to the well-studied Al1-xGaxN and SixGe1-x alloy systems whereatomic mass difference dominates the alloy scattering. This work studies andprovides the quantitative knowledge for phonon scattering and the thermalconductivity in Al1-xScxN, paving the way for future investigation of materialsand design of acoustic devices.

Phonon heat conduction in Al1-xScxN thin films