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It is known that 3D-ICs suffer from hot spot temperatures that can reachthousands of degrees, if they are not cooled to reasonable operatingtemperatures. The problem of hot spots is not limited to the high temperaturesof the IC; thermal stress can also pose severe problems, even after cooling thechip. This study investigates thermal stress resulting from a 3D-IC hot spotwith 20 W power dissipation. The IC is cooled using SiO2 and diamond coolingblocks. The study is performed using three cooling liquids: water, Freon (R22),and Liquid Nitrogen (LN). As expected, the study shows that metal layers on thechip suffer from high thermal stress due to rising the chip temperature tovalues higher than the room temperature. It is also noticed that the stressbecomes more severe, if cooling is done using LN. In fact, the stress exceededthe maximum tensile strength of aluminum, which means failure of the chip. Thisindicates that cooling 3D-IC may not ensure acceptable operation orreliability. Thermal stress must be investigated at both high and lowtemperatures to ensure high performance and acceptable reliability.

Thermal Stress Analysis of Liquid-Cooled 3D-ICs