English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Plus monthly

Global: Zendy Tools annual

Global: Zendy Tools monthly

Global: Zendy Free Plan

Hot-spots are considered among the unavoidable consequences of the highintegration density of 3D-ICs. Eliminating hot spots requires employingefficient cooling techniques. Using embedded channels, liquid cooling systemscan be designed to deliver the right amount of coolant to each spot of thechip. In this study, numerical analysis is used to investigate the cooling of a20 W hot spot using embedded channels employing three coolants: water, Freon(R22), and liquid nitrogen (LN). The investigation of thermal management andstress show that, although LN provides the lowest operating temperature (164K), it causes the highest stress (355 MPa) at 100 mm/s inlet velocity. Thestudy also shows that, coolant delivery using parallel channels results in awide variation of local temperatures and stress. This stress variation may formhigh-stress spots, which may cause circuit failure, performance degradation, oryield reduction. Therefore, cooling systems and chip fabrication should bedesigned to ensure the elimination of high-stress hot spots.

Numerical Analysis of Liquid Cooling of 3D-ICs Using Embedded Channels