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Amorphous silica deforms viscoplastically at elevated temperatures, as iscommon for brittle glasses. The key mechanism of viscoplastic deformationinvolves interatomic bond switching, which is known to be a thermally activatedprocess. In this study, through systematic in-situ compression tests byscanning electron microscopy, the viscoplastic deformation of amorphous silicais observed without thermal activation. Furthermore, ductility does notincrease monotonically with acceleration voltage and current density of the SEMe-beam but is maximized by a factor of three at a specific acceleration voltageand current density conditions (compared to beam-off conditions). A Monte Carlosimulation of the electron-matter interaction shows that the unique trends ofviscoplastic deformation correlate with the interaction volume, i.e., theregion within the material where inelastic electron scattering occurs. Changingthe size of the migrating atomic clusters can lead to facility inrearrangements of the intramolecular bonds, hence leading to more sustainedbond switching. Based on the interaction volume the mechanical shaping ofsmall-scale amorphous silica structures under e-beam irradiation can be modeledwith high-precision supporting the idea that this relatively low-voltagee-beam-irradiation induced viscoplastic-deformation technique holds greatpotential for advancing amorphous silica structure manufacturing and developinge-beam assisted manufacturing for covalently bonded non-metallic materials.

Glass shaping at nanoscale: Mechanical forming of brittle amorphous silica by engineered inelastic interaction of scanning electrons with matter