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As shown in our previous studies, geometrical field grading techniques suchas stacked and protruding substrate designs cannot well mitigate high electricstress issue within power electronics modules. However, it was shown that acombination of protruding substrate design and applying a nonlinearfield-dependent conductivity layer could address the issue. Electric field (E)simulations were carried out according to IEC 61287-1 for the partial dischargetest measurement step, where a 50/60 Hz AC voltage was applied. However,dielectrics, including ceramic substrate and silicone gel, in power devicesundergo high temperatures up to a few hundred degrees and frequencies up to 1MHz. Thus, E values obtained with electrical parameters of the mentioneddielectrics for room temperature and under 50/60 Hz may not be valid for hightemperatures and frequencies mentioned above. In this paper, we address thistechnical gap through developing a finite element method (FEM) E calculationmodel developed in COMSOL Multiphysics where E calculations are carried out fordifferent temperatures up to 250 C and frequencies up to 1 MHz. Using themodel, the influence of temperature and frequency on our proposed electricfield mitigation technique mentioned above is evaluated.

Influence of Temperature and Frequency on Electric Field Reduction  Method via a Nonlinear Field Dependent Conductivity Layer Combined with  Protruding Substrate for Power Electronics Modules