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SnBiInZn based high entropy alloy (HEA) was studied as a low reflowtemperature solder with melting point around 80 oC. The wetting angle is about52o after reflow at 100 oC for 10 min. The interfacial intermetallic compound(IMC) growth kinetics was measured to be ripening-control with a low activationenergy about 18.0 kJ/mol, however, the interfacial reaction rate is very slow,leading to the formation of a very thin IMC layer. The low melting point HEAsolder has potential applications in advanced electronic packaging technology,especially for bio-medical devices.

A high entropy alloy as very low melting point solder for advanced electronic packaging