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The possibility of tailoring the critical strain of 2D materials will becrucial for the fabrication of flexible devices. In this paper, the fracture inpolycrystalline MoS2 films with two different grain orientations is studied atthe micro- and nanoscale using electron microscopy. The critical uniaxialstrain is determined to be approximately 5% and independent of the samplemorphology. However, electron beam irradiation is found to enhance theinteraction between the MoS2 and the PDMS substrates, leading to an increasedcritical strain that can exceed 10%. This enhancement of strain resistance wasused to fabricate a mechanically robust array of lines 1 mm in length. Finally,nanoscale crack propagation studied by transmission electron microscopy showedthat cracks propagate along the grain boundaries as well as through the grains,preferentially along van der Waals bonding. These results provide insightregarding the fracture of polycrystalline 2D materials and a new method totailor the critical strain and nanofabrication of ultra-thin MoS2 devices usingwell-developed tools, which will be of great interest to the flexibleelectronics industry.

Fracturing of polycrystalline MoS$_2$ nanofilms