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This paper proposes 3D field simulation models for different designs ofintegrated bond wire on-chip inductors. To validate the simulation models,prototypes for three designs with air and ferrite cores are manufactured andmeasured. For air core inductors, high agreement between simulation andmeasurement is obtained. For ferrite core inductors, accurate models require anexact characterization of the ferrite material. These models enable theprediction of magnetic field influences on underlying integrated circuits.

3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements