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The life time of electronic circuits board are impacted by the voids presentin soldering balls. The quality inspection of solder balls by detecting andmeasuring the void is important to improve the board yield issues in electroniccircuits. In general, the inspection is carried out manually, based on 2D or 3DX-ray images. For high quality inspection, it is difficult to detect andmeasure voids accurately with high repeatability through the manual inspectionand it is time consuming process. In need of high quality and fast inspection,various approaches were proposed for void detection. But, lacks in robustnessin dealing with various challenges like vias, reflections from the plating orvias, inconsistent lighting, noise, void-like artefacts, various void shapes,low resolution images and scalability to various devices. Robust BGA voiddetection becomes quite difficult problem, especially if the image size is verysmall (say, around 40x40) and with low contrast between void and the BGAbackground (say around 7 intensity levels on a scale of 255). In this work, wepropose novel approach for void detection based on the multi directionalscanning. The proposed approach is able to segment the voids for low resolutionimages and can be easily scaled to various electronic manufacturing products.

Robust BGA Void Detection Using Multi Directional Scan Algorithms