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The Belle II experiment, which is situated at the interaction point of theSuperKEKB $e^+e^{-}$ collider at KEK, Tsukuba, Japan, is expected to collectdata corresponding to an integrated luminosity of 50~ab$^{- 1}$. This data setwill be sensitive to beyond-the-standard-model physics via precisionmeasurements and searches for very rare decays. At its heart lies a six-layervertex detector consisting of two layers of pixel detectors (PXD) and fourlayers of double-sided silicon microstrip detectors (SVD). Precise vertexing asprovided by this device is essential for measurements of time-dependent $CP$violation. Crucial aspects of the SVD assembly are precise alignment, as wellas rigorous electrical and geometrical quality assurance. We present anoverview of the construction of the SVD, including the precision gluing of SVDcomponent modules and the wire-bonding of various electrical components. Wealso discuss the electrical and geometrical quality assurance tests.

Construction and quality assurance of the Belle II Silicon Vertex Detector