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The paper presents numerical results on an innovative concept of anefficient, site-specific cooling technology for microprocessor hot spots usingAlternating Current Electrothermal Flow (ACET). ACET deploys an electrokinetictransport mechanism without requiring any external prime mover and can be shownto be highly effective in reducing hot spot temperatures below their allowablelimits. The proposed technique leverages the heat source(s) itself to drive thefluid in the ACET cooling mechanism, thereby making this a highly energyefficient active technique. Our parametric analyses present the optimal rangeof fluid properties, viz. electrical conductivity where the cooling efficiencyis maximum. Further, the impact of geometrical parameters as well as inputvoltages has been characterized. Our results show a reduction of hot spottemperature by more than 30% for flow through a channel of 600 microns underappropriate conditions at an applied AC voltage of 10-12 V. Comparison withother micro-cooler technologies show the proposed technique to be more energyefficient in its range of operation. These results establish the potential ofthe ACET cooling and can open up a new avenue to be explored for thermalmanagement of miniaturized devices and systems.

Alternating Current Electrothermal Flow for Energy Efficient Thermal Management of Microprocessor Hot Spots