English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Tools annual

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Presents the access of premium content as premium feature

Premium Content

Global: Zendy Plus annual

Global: Zendy Free Plan

.On the basis of requirement of CSNS, we designed a TDC chip with temperaturecompensation function in this paper, which employed TSMC 180nm process. Usingdelay unit bufx8 as the major method, delay lines in each level delayed inputsignal line through the bufx8 unit to realize fundamental measurement function.The time intervals of two fixed delay standard pulses did not change withtemperature variation via intra-chip phase-locked loop. After that, the twostandard pulses were sent to TDC internal delay line and measured their values.Then the measured values and standard values were compared. According to theresult of comparing and decision switch, the structure of delay lines wasreconstructed and their levels were recorded at the same time. We could ensurethat the total length of the effective delay line were close to clock cycle asmuch as possible under the current temperature. The chip was tested after thecompletion of design. It was found that the time resolution of TDC ASIC was73ps under 1.8V power supply at room temperature while the time resolutionswere 103ps and 62ps at 85$^\circ$ and 0$^\circ$, respectively.

Design of TDC ASIC based on Temperature Compensation