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Sn-Ag-Cu (SAC) alloys are commonly recognized as lead-free solders employedin the electronics industry. However, some disadvantages in mechanicalproperties and their higher melting temperatures compared to Pb-Sn soldersprompt new research relating to reinforcement of existing SAC solders. One ofthe ways to reinforce these solder materials is the formation of compositeswith nanoparticles as filler materials. Accordingly, this study presentsstructural features of nanocomposite (Sn-3.0Ag-0.5Cu)100-x(nanoCo)x solderswith up to 0.8 wt.% nano Co. The effect of nano-sized Co particles wasinvestigated by means of differential thermal analysis (DTA), X-ray diffraction(XRD) in both liquid and solid states, and scanning electron microscopy (SEM).The experimental data of DTA are compared with available literature data forbulk Sn 3.0Ag-0.5Cu alloy to check the capability of minor nano-inclusions todecrease the melting temperature of the SAC solder. The combination ofstructural data in liquid and solid states provides important information aboutthe structural transformations of liquid Sn 3.0Ag 0.5Cu alloys caused by minorCo additions and the phase formation during crystallization. Furthermore,scanning electron microscopy has shown the mutual substitution of Co and Cuatoms in the Cu6Sn5 and CoSn3 phases, respectively.

Effect of nano Co reinforcements on the structure of the Sn-3.0Ag-0.5Cu solder in liquid and after reflow solid states