English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Plus monthly

Global: Zendy Tools annual

Global: Zendy Tools monthly

Global: Zendy Free Plan

Photonic integrated circuits (PICs) directly written with a femtosecond laserhave shown great potential in many areas such as quantum information processing(QIP). Many applications, like photon-based quantum computing, demand theup-scaling of PICs and ever-higher optical performance, such as controllablepolarisation dependence and lower loss. In order to overcome currentlimitations in fabrication precision, repeatability and material uniformity, asolution for non-destructive testing of large-scale PICs in a component-wisemanner is desired to meet those ever-stricter demands. Here we demonstrate asolution for non-destructive component-wise testing by predicting theperformance of a PIC component based on imaging with an adaptive opticalthird-harmonic-generation (THG) three-dimensional (3D) microscope. The 3D THGimaging can be performed on any component or part of it inside multi-componentPIC. Moreover, through discovering new phenomena we also demonstrated that 3DTHG microscopy provides a new pathway towards studying the fundamentals oflight-matter interaction in transparent materials.

Microscopic characterisation of laser-written phenomena for component-wise testing of photonic integrated circuits