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We report on the first through-wafer silicon-based Electrostatic QuadrupoleArray (ESQA) to focus high energy ion beams. This device is a key enabler for awafer based accelerator architecture that lends itself to orders-of-magnitudereduction in cost, volume and weight of charged particle accelerators. ESQs area key building block in developing compact Multiple Electrostatic QuadrupoleArray Linear Accelerator (MEQALAC) [1]. In a MEQALAC electrostatic forces areused to focus ions, and electrostatic field scaling permits high beam currentdensities by decreasing the beam aperture size for a given peak electric fieldset by breakdown limitations. Using multiple parallel beams, each totaling toan area A, can result in higher total beam current compared to a singleaperture beam of the same area. Smaller dimensions also allow for higherfocusing electric field gradients and therefore higher average beam currentdensity. Here we demonstrate that Deep Reactive Ion Etching (DRIE)micromachined pillar electrodes, electrically isolated by silicon-nitride thinfilms enable higher performance ESQA with waferscale scalability. Thefabricated ESQA are able to hold up to1 kV in air. A 3*3 array of 12 keV argonion beams are focused in a wafer accelerator unit cell to pave the way formultiple wafer accelerator.

Waferscale Electrostatic Quadrupole Array for Multiple Ion Beam Manipulation